Description
Thermal Conductive Double-Sided Adhesive Tape for Heatsink, LED Strips, CPU, GPU & Electronics
The Thermal Conductive Double-Sided Tape is a practical thermal adhesive solution designed to improve heat transfer between electronic components and heatsinks or other cooling surfaces. It combines thermal conductivity with strong double-sided adhesion, making it useful for applications where conventional thermal paste or mechanical mounting is difficult.
The tape can help fill small surface irregularities and air gaps between components, creating better thermal contact. It is suitable for high-power LEDs, power supplies, CPUs, GPUs, MOSFETs, IGBT modules, RAM, SSDs, motor controllers, automotive electronics, communication equipment, and other heat-generating electronic components.
Its flexible construction makes it easy to apply, while the strong adhesive provides a secure bond, eliminating the need for additional mechanical fasteners in many applications. The tape is available in multiple sizes to suit different component and heatsink requirements.
Note: Thermal performance depends on the application, contact surfaces, component temperature, pressure, and installation quality.
Key Features
- Double-sided thermally conductive adhesive tape.
- Provides both thermal transfer and adhesion.
- Helps improve heat dissipation from electronic components.
- Suitable for attaching heatsinks to components.
- Flexible and conforms to slightly uneven surfaces.
- Helps fill small surface irregularities and air gaps.
- Easy to cut and apply.
- No mixing or curing required.
- Strong adhesive bonding.
- Suitable for beginners and professional applications..
- Available in multiple sizes.
- Designed for electronics and thermal management applications.
- Suitable for long-term use under recommended operating conditions.
Technical Specifications
| Parameter | Specification |
|---|---|
| Product Type | Thermal Conductive Double-Sided Tape |
| Adhesive Type | Double-Sided Thermal Adhesive |
| Construction | Flexible Thermal Conductive Tape |
| Application | Heat Transfer & Component Mounting |
| Surface Type | Electronic Components / Heatsinks |
| Adhesive | Double-Sided |
| Thermal Conductivity | Thermally Conductive |
| Flexibility | Yes |
| Surface Conformability | Suitable for Slightly Uneven Surfaces |
| Available Sizes | Multiple Sizes |
| Recommended Temperature | 80–120°C normal-temperature operating range as stated by manufacturer |
| Typical Service Life | Up to 5 years under stated normal operating conditions |
| Application Method | Peel, Position & Press |
| Use | Passive Heat Dissipation / Heatsink Mounting |
Applications
- High-Power LED Heatsinks
- LED Modules
- CPU and GPU Heatsinks
- Graphics Card RAM
- DDR Memory Modules
- SSD Drives
- MOSFET Cooling
- IGBT Modules
- Power Semiconductors
- DC Motor Controllers
- Power Supplies
- Automotive Electronic Modules
- Communication Equipment
- Electronic Control Boards
- New Energy Equipment
- Other Heat-Generating Electronic Components
Precautions
- Ensure both surfaces are clean, dry, and free from dust, grease, and oil before application.
- Remove the protective liner carefully without contaminating the adhesive surface.
- Apply the tape evenly without trapping air bubbles.
- Ensure maximum possible contact between the component and heatsink.
- Do not exceed the manufacturer's recommended operating temperature.
- Do not reuse the tape after removal.
- Use an appropriately sized piece of tape for the component.
- Thermal performance depends on proper surface preparation and installation.
- The tape should not be used as a substitute for mechanical mounting where the application requires mechanical support.
- Avoid touching the adhesive surfaces excessively during installation.
- Store unused tape in a cool, dry and clean environment.