Mechanic: V-Series Solder Paste for SMD BGA SMT Rework 138°C

MECHANIC Solder Paste for SMD, BGA & SMT Rework

MECHANIC V-series solder pastes (V3B45, V4B45, V5B45, V6B45, V8B45) are primarily low-temperature (138°C) lead-free pastes designed for SMD/BGA rework, offering excellent wettability and strong adhesion. 
Achieve clean, reliable, and professional solder joints with MECHANIC Solder Paste, specially formulated for SMD, BGA, and SMT stencil welding applications. Designed for use with rework stations and precision soldering tasks, this high-performance paste ensures excellent wetting, smooth reflow, and strong electrical connections.

Available in multiple variants, it is ideal for PCB repair, motherboard rework, and advanced electronics assembly.

The primary differences are in package size (e.g., 20g vs 60g) and specific particle size distribution (powder mesh) for stencil printing Vs. manual needle application.

Key Features:

• High-quality solder paste for SMD, BGA, and SMT

• Smooth reflow performance with strong bonding

• Excellent wetting and oxidation resistance

• Suitable for stencil printing and rework stations

• Minimal residue after soldering

• Stable performance for precision electronics

• Ideal for PCB repair and assembly work

• Available in multiple weight options

Technical Specifications

Applications

• SMD component soldering

• BGA chip reballing and rework

• SMT stencil printing

• PCB repair and prototyping

• Motherboard and mobile repair

• Industrial electronics assembly

• Laboratory and training use

Precautions

• Store in a cool and dry place

• Keep sealed when not in use

• Avoid direct sunlight exposure

• Use a proper temperature profile during reflow

• Wear protective gloves when handling

• Keep away from children