Description
Professional High-Activation BGA Flux Paste for Precision Soldering & Rework
The MECHANIC TF350 Special Flux Paste is specially formulated for professional BGA (Ball Grid Array) soldering, rework, and PCB repair applications. Designed for technicians and electronics repair experts, this high-activity flux ensures superior solder wetting, smooth reflow, and strong, reliable solder joints.
Whether you are performing BGA chip replacement, SMT assembly, or motherboard repair, TF350 provides excellent oxide removal, improved heat transfer, and consistent performance across various temperature profiles.
Perfect for mobile repair labs, service centres, electronics workshops, and industrial rework stations.
Key Features
• High activation formula for effective oxide removal
• Excellent solder wetting and smooth reflow performance
• Non-corrosive and non-conductive formulation
• Minimal residue and easy post-cleaning
• Wide temperature compatibility
• Improves heat transfer during reflow
• Reduces solder bridges and voids
• Ideal for BGA, SMT, and PCB repair
• Smooth paste consistency for precise application
• Professional-grade reliability
Technical Specifications
| Parameter | Specification |
|---|---|
| Product Name | MECHANIC TF350 Special Flux Paste |
| Type | BGA Special Flux |
| Form | Paste |
| Application | BGA, SMT, PCB Rework |
| Activation Level | High |
| Residue | Low, Easy to Clean |
| Corrosion | Non-Corrosive |
| Conductivity | Non-Conductive |
| Temperature Compatibility | Wide Reflow Range |
| Cleaning Method | IPA / Flux Cleaner |
Applications
• BGA soldering and reballing
• BGA chip removal and replacement
• SMT component assembly
• Motherboard repair
• PCB rework and maintenance
• Pre-solder surface cleaning
• Prototype development
• Electronics training and lab use
• Heat-assisted reflow processes
How to Use
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Clean PCB pads and BGA balls thoroughly.
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Apply a small amount of TF350 flux paste to solder area.
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Position the BGA component accurately.
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Heat using reflow oven, hot air station, or soldering tool.
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Allow natural cooling.
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Clean residue with IPA if required.
Precautions
• Store in a cool, dry place
• Avoid direct sunlight exposure
• Use in a well-ventilated area
• Keep away from children
• Do not ingest
• Clean residue after soldering for best performance
• Avoid rapid cooling to prevent thermal stress